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Although AMD has been happy to provide news clips about its upcoming Zen 3 Milan microarchitecture CPUs, thanks in part to a well-documented roadmap, there are few details on our expectations for these chips. However, new rumors indicate that AMD plans to increase the number of IPCs, which will generate a significant power increase.

A source told RedGamingTech that the IPC jump will be at least 8% higher than the existing Zen 2 technology, and reported an engineering sample of the Zen 3 technology, which has a clock speed of approximately 100 to 200 MHz higher than the existing Zen 2. CPU. AMD Zen 3

micro-architecture is based on 7nm and above process node technology, and will adhere to the 8-core chiplet configuration implemented in Zen 2 chips. It is expected to be the last Zen design to use format socket AM4.

We already know that AMD Zen 3 CPU will have a different cache arrangement. Zen 2’s 16MB L3 cache is not allocated to each core complex array by splitting the core complex array, but the new chip uses 32MB L3 cache for each core complex array, which means that each core can access a larger amount of cache. This should significantly reduce latency. Coupled with a higher number of IPCs and higher clock speeds, we have seen a huge leap in raw performance.

Although it only released the Zen 2 chip in July, AMD is clearly pushing the Zen 3 Milan CPU. They have already exited the design phase and are scheduled to be released sometime in 2020. If they prove to be as successful as their predecessors, AMD may further increase its market share from the already impressive 30% and continue to erode Intel's market share. Ten years of dominance.

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